Principal SoC Architect (Connectivity)

Our client is an international semiconductor technology company developing advanced solutions for a range of high-tech markets, including automotive, industrial, communications, and connected devices. The company operates across multiple international locations and brings together engineering teams working on complex system-on-chip (SoC) technologies.

The Role

This is a senior/principal-level role sitting at the intersection of chip engineering, product strategy, and customer requirements: the core of the job is translating what customers want into what the silicon should look like.

As a System Architect for connectivity SoCs, you will act as the bridge between Marketing and customers, who express needs like lower power, smaller size, or lower cost, and the design engineers who need precise technical specifications to build the chip.

You will help shape state-of-the-art SoC architectures for the Division's connectivity products, working closely with standardization bodies, vendors, and internal design teams to turn ambiguous requirements into concrete, buildable specifications.

Key Responsibilities

• Translate customer and standardization body requirements into state-of-the-art SoC architectures and detailed target specifications
• Define innovative and robust architectural plans for connectivity SoCs, targeting the lowest power consumption, smallest system size, and lowest cost
• Derive new concepts and IP blocks for future-oriented ICs, including external IP selection and vendor relationships
• Drive feasibility assessments of new product platforms
• Conduct performance evaluation and simulation of SoC architectures (e.g., bus and cache performance)
• Generate key technical documentation, including Objective Specifications, Datasheets, Verification Plans, and Production Test Plans
• Scan related technologies and market trends, and contribute to competitive analysis
• Collaborate closely with Marketing, design engineers, and standardization bodies to align technical direction with customer needs

What You'll Bring

• BSc or MSc degree in Electrical/Electronics Engineering
• Proven experience in system definition and concept engineering within the semiconductor industry
• Strong background in digital design, ideally with a solid track record as a system architect
• Experience with embedded SoCs, including microcontroller, DSP, RF, and analog mixed-signal content
• Good understanding of IC design and manufacturing processes
• System-level knowledge of low-power wireless systems and protocols (e.g., Bluetooth, Wi-Fi)
• Solid understanding of embedded system-on-chip architectures, embedded systems, and embedded software architectures
• Ability to analyze complex, sometimes ambiguous customer requirements using internal technical know-how and best practices
• Strong analytical, creative, and innovative thinking, with excellent communication and teamwork skills
• High degree of autonomy and a results-driven, self-starting approach
• Fluent English

Nice to Have

• Direct experience engaging with standardization bodies (e.g., Bluetooth SIG, Wi-Fi Alliance)
• Hands-on background in RF and analog mixed-signal IC design
• Genuine passion for staying at the forefront of emerging connectivity technologies

What's in It for You 

€4000 – €5500 Gross / Month, depending on experience. Position is hybrid 3-2 (3 days from the office) at Athens offices.

This is a rare opportunity to shape the architecture of next-generation connectivity chips at a truly global semiconductor company, working alongside an experienced, internationally distributed engineering team, with real influence over how technology reaches millions of devices worldwide.